The TSMC-SoIC is a service platform that provides innovative front-end, 3D inter-chip staking technology for re-integration of chips partitioned from System on Chip. What happens after the integration is that we have an integrated chip that outperforms the original SoC its derived from. The system performance is incredible.
There are multiple benefits of these integrated chips. They are flexible and can integrate additional system functionalities into itself. The increased bandwidth and lower latency allow it to perform quickly and meet the requirements of the ever-increasing computing.
Let’s take a look at the following infographic for an in-depth look at these powerful chips.
Infographic by: tsmc